Manufacrure High Durability 1.8W/M-K Thermal Conductive Silicone Pad For Electronic Devices

Company Profile

Ziitek Electronic Material and Technology Ltd.  is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable 

partner of you. Let's make your design more perfect!

Product introduction

The TIF™580-18-11U Series Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or themetal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiencyand life-time of the heat-generating electronic components.

Feature

> Good thermal conductive:1.8W/m-K
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized
> Moldability for complex parts
> Naturally tacky needing no further adhesive coating

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics

Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.

Why Choose us ?